關鍵詞: 人造金剛石 銅基釬料 浸潤 釬焊
Abstract
There is high interfacial energy between diamond and general metals which resulting the diamond grain can't be wetted by generally low-melting-point alloys and diamond grain will peel off easily. In order to solve the above problems, we have developed two new brazing filler with Cu, besides, Sn, Ti as additional elements. Determining the reasonable elemental composition to solve the problem of wetting of the diamond, meanwhile filler melting temperatures will be moderated in 950 ℃, and the diamond will not lead to graphitization. Brazing filler possess appropriate hardness, when it cuts, the diamond will expose cutting tool’s blade quickly not peel off and to improve cutting efficiency. Diamond will present floating in brazing, so we need to powder as playing a role of skeleton.
